Basic requirements for PVD/ sputtering to take place:
- Power (Cathode/anode) -> plasma
- Gas (Ar), sometime air when contamination is not critical
- Deposition materials (Target)
- Vacuumn chamber (vacuum pump) -> also to prevent oxidation
High consumption are coming from foundries in CVD module (Endura tool), the materials or targets used are usually metals such as Al, Cu, Ti, W, TiN, Co..etc
Smaller (1~3″) and thinner disc foil targets are required from laboratories with sputtering coater. These coater deposits a very thin film over samples to be viewed in imaging tool such as SEM. The usual material that of these targets are conductive materials such as Au, Ag, C and Pt.
Targets used in R&D are least common but high demanding, they could be composition of metals and non metals. Composite targets require very experienced maker to produce finished product of high quality.